Ceramic Fibre Board is a rigid insulating material available in light, medium and heavy densities and manufactured using refined ceramic fibres, fillers and binders.
Ceramic Fibre Boards are ideal for use at elevated temperatures of up to 1400˚C as they exhibit excellent strength characteristics.
Ceramic Fibre Board is an ideal material for back-up insulation, flue linings, boiler ducts, furnace and kiln linings.
The structure of Ceramic Fibre Board lends itself to high definition machining and production of technically complex machined parts and shapes.
Other benefits include:
Refractory Ceramic Fibre in the form of bulk, chopped,blanket, blanket modules,board and shapes are made from inorganic amorphous glass fibre (RCF).
KEY DATA | |||||
---|---|---|---|---|---|
1260 | 1260 | 1260 | 1400 | 1600 | |
Low Density | Medium Density | High Density | Low Density | Low Density | |
MAXIMUM TEMPERATURE | |||||
˚C | 1260 | 1260 | 1260 | 1426 | 1600 |
˚F | 2300 | 2300 | 2300 | 2600 | 2900 |
CONTINUOUS USE LIMIT | |||||
˚C | 1149 | 1149 | 1149 | 1316 | 1426 |
˚F | 2100 | 2100 | 2100 | 2400 | 2600 |
MELTING POINT | |||||
˚C | 1732 | 1732 | 1732 | 1780 | 1850 |
˚F | 3150 | 3150 | 3150 | 3236 | 3362 |
DENSITY lbs/ft3 | 14 - 18 | 20 - 24 | 26 - 30 | 14 - 18 | 14 - 18 |
kg/m3 | 225 - 290 | 320 - 385 | 415 - 480 | 225 - 290 | 225 - 290 |
THERMAL SHRINKAGE (%) | |||||
24 hours @ 2200 ˚F | 2 - 3 | 1 - 2 | 1 - 2 | 1 - 2 | 1 - 2 |
THERMAL CONDUCTIVITY (W/mK)(Btu in/hr ft2 ˚F) | |||||
316˚C (600˚F) | 0.06 0.5 | 0.07 0.6 | 0.10 0.9 | 0.06 0.5 | 0.06 0.5 |
538˚C (1000˚F) | 0.07 0.6 | 0.08 0.7 | 0.11 1.0 | 0.07 0.6 | 0.07 0.6 |
760˚C (1400˚F) | 0.09 0.8 | 0.10 0.9 | 0.13 1.2 | 0.09 0.8 | 0.09 0.8 |
1094˚C (2000˚F) | 0.13 1.2 | 0.13 1.2 | 0.16 1.4 | 0.13 1.2 | 0.13 1.2 |
CHEMICAL ANALYSIS (%) | |||||
AL2O3 | 39 - 41 | 45 - 47 | 43 - 45 | 48 - 50 | 63 - 65 |
SiO2 | 52 - 54 | 44 - 46 | 47 - 49 | 45 - 47 | 32 - 34 |
Others | 2 - 3 | 2 - 3 | 2 - 3 | 1 - 2 | 1 - 2 |
The data provided is taken from average test results conducted under standard procedures and conditions and should not be used for specification purposes. |